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铠侠(KIOXIA)SLC NAND闪存存储器
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铠侠(KIOXIA)的SLC(单层存储单元) NAND闪存存储器, 具有多种容量和封装形式可供选择,可满足嵌入式市场的不同需求。它提供两种接口选项(8位并行接口和4位SPI串行接口),客户能够根据主机控制器的纠错能力和存储器接口,选择合适的SLC NAND闪存。它的高速写入大量数据,以及高的擦写次数,使其具有耐久性和可靠性的特征,非常适用于对可靠性和寿命要求非常高的消费类电子产品和工业设备的应用。
 
示意图
 
特性
SLC NAND BENANDTM Serial Interface NAND
采用并行接口
24nm SLC NAND处理技术
供电电压1.8V和3.3V
可提供多种密度:
– 1Gbit, 2Gbit, 4Gbit, 8Gbit, 16Gbit
可提供的封装:
– 48TSOP (12 x 20 mm)
– 63BGA (9 x 11 mm)
– 67BGA (6.5 x 8 mm)
– 132BGA (12 x 18 mm)
采用并行接口
嵌入ECC引擎
24nm SLC NAND处理技术
供电电压1.8V和3.3V
接口、功能和命令兼容SLC NAND
可提供多种密度:
– 1Gbit, 2Gbit, 4Gbit, 8Gbit
可提供的封装:
– 48TSOP (12 x 20 mm)
– 63BGA (9 x 11 mm)
– 67BGA (6.5 x 8 mm)
支持Mode 0和Mode 3串行SPI接口
嵌入ECC引擎
24nm SLC NAND处理技术
供电电压1.8V和3.3V
可提供多种密度:
– 1Gbit, 2Gbit, 4Gbit, 8Gbit
可提供的封装:
– WSON8 (6 x 8mm)
 
应用领域
数码相机和数字电视
电视机顶盒
便携游艺机
激光打印机
监控摄像机
穿戴设备
 
主要器件
SLC NAND
Part Number Tech.
node
(nm)
Capacity
(bit)
VCC
(V)
Page
size
(bit)
Block
Size
(bit)
Operating
Temperature
(°C)
Package
Name
Number
of
pins
TC58NVG0S3HBAI4 24 1G 2.7 to 3.6 (2048+128)x8 (128K+8K)x8 -40 to 85 FBGA 63
TC58NVG0S3HBAI6 24 1G 2.7 to 3.6 (2048+128)x8 (128K+8K)x8 -40 to 85 FBGA 67
TC58NVG0S3HTA00 24 1G 2.7 to 3.6 (2048+128)x8 (128K+8K)x8 0 to 70 TSOP 48
TC58NVG0S3HTAI0 24 1G 2.7 to 3.6 (2048+128)x8 (128K+8K)x8 -40 to 85 TSOP 48
TC58NVG1S3HBAI4 24 2G 2.7 to 3.6 (2048+128)x8 (128K+8K)x8 -40 to 85 FBGA 63
TC58NVG1S3HBAI6 24 2G 2.7 to 3.6 (2048+128)x8 (128K+8K)x8 -40 to 85 FBGA 67
TC58NVG1S3HTA00 24 2G 2.7 to 3.6 (2048+128)x8 (128K+8K)x8 0 to 70 TSOP 48
TC58NVG1S3HTAI0 24 2G 2.7 to 3.6 (2048+128)x8 (128K+8K)x8 -40 to 85 TSOP 48
TC58NVG2S0HBAI4 24 4G 2.7 to 3.6 (4096+256)x8 (256K+16K)x8 -40 to 85 FBGA 63
TC58NVG2S0HBAI6 24 4G 2.7 to 3.6 (4096+256)x8 (256K+16K)x8 -40 to 85 FBGA 67
TC58NVG2S0HTA00 24 4G 2.7 to 3.6 (4096+256)x8 (256K+16K)x8 0 to 70 TSOP 48
TC58NVG2S0HTAI0 24 4G 2.7 to 3.6 (4096+256)x8 (256K+16K)x8 -40 to 85 TSOP 48
TC58NYG0S3HBAI4 24 1G 1.70 to 1.95 (2048+128)x8 (128K+8K)x8 -40 to 85 FBGA 63
TC58NYG0S3HBAI6 24 1G 1.70 to 1.95 (2048+128)x8 (128K+8K)x8 -40 to 85 FBGA 67
TC58NYG1S3HBAI4 24 2G 1.70 to 1.95 (2048+128)x8 (128K+8K)x8 -40 to 85 FBGA 63
TC58NYG1S3HBAI6 24 2G 1.70 to 1.95 (2048+128)x8 (128K+8K)x8 -40 to 85 FBGA 67
TC58NYG2S0HBAI4 24 4G 1.70 to 1.95 (4096+256)x8 (256K+16K)x8 -40 to 85 FBGA 63
TC58NYG2S0HBAI6 24 4G 1.70 to 1.95 (4096+256)x8 (256K+16K)x8 -40 to 85 FBGA 67
TH58NVG3S0HBAI4 24 8G(4Gx2) 2.7 to 3.6 (4096+256)x8 (256K+16K)x8 -40 to 85 FBGA 63
TH58NVG3S0HBAI6 24 8G(4Gx2) 2.7 to 3.6 (4096+256)x8 (256K+16K)x8 -40 to 85 FBGA 67
TH58NVG3S0HTA00 24 8G(4Gx2) 2.7 to 3.6 (4096+256)x8 (256K+16K)x8 0 to 70 TSOP 48
TH58NVG3S0HTAI0 24 8G(4Gx2) 2.7 to 3.6 (4096+256)x8 (256K+16K)x8 -40 to 85 TSOP 48
TH58NVG4S0HTA20 24 16G(4Gx4) 2.7 to 3.6 (4096+256)x8 (256K+16K)x8 0 to 70 TSOP 48
TH58NVG4S0HTAK0 24 16G(4Gx4) 2.7 to 3.6 (4096+256)x8 (256K+16K)x8 -40 to 85 TSOP 48
TH58NYG3S0HBAI4 24 8G(4Gx2) 1.70 to 1.95 (4096+256)x8 (256K+16K)x8 -40 to 85 FBGA 63
TH58NYG3S0HBAI6 24 8G(4Gx2) 1.70 to 1.95 (4096+256)x8 (256K+16K)x8 -40 to 85 FBGA 67
 
BENANDTM
Part Number Tech.
node
(nm)
Capacity
(bit)
VCC
(V)
Page
size
(bit)
Block
Size
(bit)
Operating
Temperature
(°C)
Package
Name
Number
of
pins
TC58BVG0S3HBAI4 24 1G 2.7 to 3.6 (2048+64)x8 (128K+4K)x8 -40 to 85 FBGA 63
TC58BVG0S3HBAI6 24 1G 2.7 to 3.6 (2048+64)x8 (128K+4K)x8 -40 to 85 FBGA 67
TC58BVG0S3HTA00 24 1G 2.7 to 3.6 (2048+64)x8 (128K+4K)x8 0 to 70 TSOP 48
TC58BVG0S3HTAI0 24 1G 2.7 to 3.6 (2048+64)x8 (128K+4K)x8 -40 to 85 TSOP 48
TC58BVG1S3HBAI4 24 2G 2.7 to 3.6 (2048+64)x8 (128K+4K)x8 -40 to 85 FBGA 63
TC58BVG1S3HBAI6 24 2G 2.7 to 3.6 (2048+64)x8 (128K+4K)x8 -40 to 85 FBGA 67
TC58BVG1S3HTA00 24 2G 2.7 to 3.6 (2048+64)x8 (128K+4K)x8 0 to 70 TSOP 48
TC58BVG1S3HTAI0 24 2G 2.7 to 3.6 (2048+64)x8 (128K+4K)x8 -40 to 85 TSOP 48
TC58BVG2S0HBAI4 24 4G 2.7 to 3.6 (4096+128)x8 (256K+8K)x8 -40 to 85 FBGA 63
TC58BVG2S0HBAI6 24 4G 2.7 to 3.6 (4096+128)x8 (256K+8K)x8 -40 to 85 FBGA 67
TC58BVG2S0HTA00 24 4G 2.7 to 3.6 (4096+128)x8 (256K+8K)x8 0 to 70 TSOP 48
TC58BVG2S0HTAI0 24 4G 2.7 to 3.6 (4096+128)x8 (256K+8K)x8 -40 to 85 TSOP 48
TC58BYG0S3HBAI4 24 1G 1.70 to 1.95 (2048+64)x8 (128K+4K)x8 -40 to 85 FBGA 63
TC58BYG0S3HBAI6 24 1G 1.70 to 1.95 (2048+64)x8 (128K+4K)x8 -40 to 85 FBGA 67
TC58BYG1S3HBAI4 24 2G 1.70 to 1.95 (2048+64)x8 (128K+4K)x8 -40 to 85 FBGA 63
TC58BYG1S3HBAI6 24 2G 1.70 to 1.95 (2048+64)x8 (128K+4K)x8 -40 to 85 FBGA 67
TC58BYG2S0HBAI4 24 4G 1.70 to 1.95 (4096+128)x8 (256K+8K)x8 -40 to 85 FBGA 63
TC58BYG2S0HBAI6 24 4G 1.70 to 1.95 (4096+128)x8 (256K+8K)x8 -40 to 85 FBGA 67
TH58BVG3S0HBAI4 24 8G(4Gx2) 2.7 to 3.6 (4096+128)x8 (256K+8K)x8 -40 to 85 FBGA 63
TH58BVG3S0HBAI6 24 8G(4Gx2) 2.7 to 3.6 (4096+128)x8 (256K+8K)x8 -40 to 85 FBGA 67
TH58BVG3S0HTA00 24 8G(4Gx2) 2.7 to 3.6 (4096+128)x8 (256K+8K)x8 0 to 70 TSOP 48
TH58BVG3S0HTAI0 24 8G(4Gx2) 2.7 to 3.6 (4096+128)x8 (256K+8K)x8 -40 to 85 TSOP 48
TH58BYG3S0HBAI4 24 8G(4Gx2) 1.70 to 1.95 (4096+128)x8 (256K+8K)x8 -40 to 85 FBGA 63
TH58BYG3S0HBAI6 24 8G(4Gx2) 1.70 to 1.95 (4096+128)x8 (256K+8K)x8 -40 to 85 FBGA 67
 
Serial Interface NAND
Part Number Tech.
node
(nm)
Capacity
(bit)
VCC
(V)
Page
size
(bit)
Block
Size
(bit)
Operating
Temperature
(°C)
Package
Name
Number
of
pins
TC58CVG0S3HRAIJ 24 1G 2.7 to 3.6 (2048+64)x8 (128K+4K)x8 -40 to 85 WSON8 8
TC58CVG1S3HRAIJ 24 2G 2.7 to 3.6 (2048+64)x8 (128K+4K)x8 -40 to 85 WSON8 8
TC58CVG2S0HRAIJ 24 4G 2.7 to 3.6 (4096+128)x8 (256K+8K)x8 -40 to 85 WSON8 8
TC58CYG0S3HRAIJ 24 1G 1.70 to 1.95 (2048+64)x8 (128K+4K)x8 -40 to 85 WSON8 8
TC58CYG1S3HRAIJ 24 2G 1.70 to 1.95 (2048+64)x8 (128K+4K)x8 -40 to 85 WSON8 8
TC58CYG2S0HRAIJ 24 4G 1.70 to 1.95 (4096+128)x8 (256K+8K)x8 -40 to 85 WSON8 8
TH58CVG3S0HRAIJ 24 8G(4Gx2) 2.7 to 3.6 (4096+128)x8 (256K+8K)x8 -40 to 85 WSON8 8
TH58CYG3S0HRAIJ 24 8G(4Gx2) 1.70 to 1.95 (4096+128)x8 (256K+8K)x8 -40 to 85 WSON8 8
 
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